New York Bids > Bid Detail
Wafer Dicing Saw and Water Conditioning/Recycling System
Agency: | |
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Level of Government: | Federal |
Category: |
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Opps ID: | NBD00159290483976695 |
Posted Date: | Sep 22, 2023 |
Due Date: | |
Source: | https://sam.gov/opp/caf609df72... |
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Active
Contract Opportunity
Notice ID
FA875123C0008
Related Notice
Contract Line Item Number
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEPT OF THE AIR FORCE
Major Command
AIR FORCE MATERIEL COMMAND
Sub Command
AIR FORCE RESEARCH LABORATORY
Office
FA8751 AFRL RIKO
Award Details
General Information
Classification
Description
Contact Information
History
- Contract Award Date: Sep 22, 2023
- Contract Award Number: FA875123C0008
- Task/Delivery Order Number:
- Contractor Awarded Unique Entity ID: M94NF1YCNLC6
- Contractor Awarded Name: DISCO HI-TEC AMERICA INC
- Contractor Awarded Address: San Jose , CA 95138 USA
- Base and All Options Value (Total Contract Value): $522,399.71
- Contract Opportunity Type: Award Notice (Original)
- All Dates/Times are: (UTC-04:00) EASTERN STANDARD TIME, NEW YORK, USA
- Original Published Date: Sep 22, 2023 02:06 pm EDT
- Inactive Policy: 15 days after contract award date
- Original Inactive Date: Oct 07, 2023
-
Initiative:
- None
- Original Set Aside:
- Product Service Code: 3670 - SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY
-
NAICS Code:
- 333242 - Semiconductor Machinery Manufacturing
-
Place of Performance:
Rome , NY 13441USA
Wafer Dicing Saw and Water Conditioning/Recycling System
Attachments/Links
Contracting Office Address
- ADMIN ONLY NO REQTN CP 315 330 7298 26 ELECTRONIC PKWY BLDG 106
- ROME , NY 13441-4514
- USA
Primary Point of Contact
- Richard Childres
- Richard.Childres@us.af.mil
Secondary Point of Contact
- Sep 22, 2023 02:06 pm EDTAward Notice (Original)
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