The Research Foundation For SUNY - SUNY Polytechnic Institute seeks a fully automated 300mm acoustic measurement system from qualified suppliers with a fully operational in-house applications lab and a worldwide semiconductor manufacturing application install base exceeding five. This system will be used for fully automated detection of bonding voids and delamination defects in bonded 300mm wafers and chiplets. The system is to integrate into the fab environment that requires FOUP to FOUP automated dry in - dry out operation, be compliant with safety standards such as SEMI, and be capable of being used under full host control by the FAB Control System.

Qualified Vendors may request the Request Proposal Documents by emailing RFP Designated Joseph Schell ( jschell@sunypoly.edu ). In their requests perspective bidders are to include appropriate details supporting their qualifications of providing and supporting 300mm acoustic measurement systems in semiconductor manufacturing applications including a fully operation in-house applications lab and a worldwide semiconductor manufacturing application install base exceeding five.