The Research Foundation For SUNY - SUNY Polytechnic Institutes seeks qualified supplier to provide up to a quantity of two (2) automated 300mm wafer inspection and measurement systems, each capable of inspecting bumped and un-bumped, thinned/carrier bonded wafers, silicon to silicon bonded wafers, and full thickness silicon wafers. The system will be used to inspect and/or measure solder bumps (height, diameter, and volume), square & circular features, filled silicon vias, wiring lines, and bonded wafer alignment. In addition, the tool will be capable of inspecting for surface defects on the entire wafer surface (topside only) and be compliant with safety standards such as SEMI, be capable of being used under full host control by the FAB Control System, and be of proven design (worldwide install base of 5+).

Qualified vendors may obtain the request for proposal documents by emailing RFP designated contact Joseph Schell ( jschell@sunypoly.edu ). Email requests for documents from qualified perspective bidders are to include appropriate details supporting their firm qualifications in regards to providing and supporting 300mm wafer and measurement systems in semiconductor manufacturing applications inclusive of a worldwide manufacturing install base exceeding five.